- Prototypes by hand through to volume production using pick and place machinery.
- Capability to place fine pitch devices and BGA's using laser and vision alighnment.
- Testing to your specificition if required.
- Recommendations on construction methods to achieve optimum performance.
- Lead free or tin lead soldering process available.
- Most assemblies can be inspected using our AOI automated optical inspection machine.
Surface Mount Printed Circuit Board Assembly
